1. High-Frequency Resonance Technology Conquers Cleaning Blind Spots

• MEMS Sensor Cleaning: Capable of removing 0.5μm-level silicon powder particles with a residue rate <0.05 particles/mm² (superior to JEDEC J-STD-001 standards);
• PCB Pad Degumming: Through 10ms pulsed power output (50-200W), it avoids pad corrosion caused by traditional solvent cleaning, reducing soldering defect rates from 0.8% to 0.1%.

2. Full-Process Non-Destructive Cleaning Process

• Power Ramping Protection: 0-100% power ramp-up time ≤15s, combined with constant amplitude control technology (fluctuation ≤±1%). When cleaning 3D-printed precision gears, the tooth surface roughness Ra value remains unchanged (original Ra0.4μm);
• Temperature Control Precision: The heating module uses a PID algorithm with temperature fluctuations of ±1°C, avoiding coating stress damage caused by temperature differences during optical lens cleaning, increasing the yield rate to 99.5%.

3. Miniaturized Design for Desktop Scenarios

• Special for Digital Maintenance: Cleans residual flux from mobile phone motherboard solder joints within 5 minutes. With ultrasonic-specific cleaning agents, ion contamination <1.5μg/cm² (compliant with IPC-TM-650 standards);
• Watch Maintenance Magic Tool: 40kHz frequency + 100W power removes sweat stains from watch strap gaps in 3 minutes, restoring stainless steel case gloss to over 98%.